Description

When the Export Step option is used in the 8.99 PCB Editor it fixes a number of bugs currently present in the 8.0.5 release.

Its a fantastic improvement but inner-layer positioning has a bug when dealing with a 4L board stack-up.

I have attached a project file and a step model and a jpg file showing the issue. In2.Cu should be separated from the B.Cu layer by 40um as defined in the board stack up. Instead it is separated by 60um. It appears that the In2.Cu layer is embedded into the Dielectric2 layer instead of sitting beneath it.

The separation between In1.CU and F.Cu appears to be correct SMD_test.kicad_pcb SMD_test.step

KiCad Version

Application: KiCad x64 on x64

Version: 8.99.0-2367-g06eb7fa588, release build

Libraries:
	wxWidgets 3.2.5
	FreeType 2.13.2
	HarfBuzz 9.0.0
	FontConfig 2.14.2

Platform: Windows 10 (build 19045), 64-bit edition, 64 bit, Little endian, wxMSW

	wxWidgets: 3.2.5 (wchar_t,wx containers)
	Boost: 1.85.0
	OCC: 7.8.1
	Curl: 8.8.0-DEV
	ngspice: 42
	Compiler: Visual C++ 1939 without C++ ABI

Locale: 
	Lang: en_GB
	Enc: UTF-8
	Num: 1,234.5